Title:
Method for manufacturing copper foil for laser processing, copper foil for laser processing with carrier foil, copper-clad laminate and printed wiring board
Document Type and Number:
Japanese Patent JP6304829
Kind Code:
B2
Abstract:
The purpose of the present invention is to provide: a copper foil for laser processing which has excellent laser processability and from which a wiring pattern can be satisfactorily formed; a carrier-foil-supported copper foil for laser processing, a copper-clad laminate, and a process for producing a printed wiring board. This copper foil for laser processing comprises a copper foil and, formed on a surface thereof, a sparingly soluble laser-light-absorbing layer which can be etched with copper etchants but has a lower etching rate than the copper foil and which absorbs infrared laser light.
More Like This:
Inventors:
Mitsuyoshi Matsuda
Yoshikawa Kazuhiro
Yoji Hara
Nobuo Fujimoto
Yoshikawa Kazuhiro
Yoji Hara
Nobuo Fujimoto
Application Number:
JP2015504326A
Publication Date:
April 04, 2018
Filing Date:
March 04, 2014
Export Citation:
Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
C25D7/06; B23K26/18; B23K26/386; C23F1/00; C25D1/04; H05K1/09; H05K3/00; H05K3/42
Domestic Patent References:
| JP2002176242A | ||||
| JP2001226796A | ||||
| JP2005260250A | ||||
| JP2001217516A | ||||
| JP2005210058A | ||||
| JP2009269242A |
Foreign References:
| WO2002024444A1 | ||||
| US4582778 |
Attorney, Agent or Firm:
Katsuhiro Yoshimura
Previous Patent: The electrical connector which unified the impedance equalization member
Next Patent: SUPPLY DEVICE FOR DEFORMED MEMBER HAVING BASE
Next Patent: SUPPLY DEVICE FOR DEFORMED MEMBER HAVING BASE