Title:
COPPER FOIL FOR PRINTED CIRCUIT BOARD AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JP3067672
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To hold peeling strength between a copper foil and a resin base material high and to provide excellent moisture resistance in a copper-clad laminate by providing a mixture coating layer containing a silane coupling agent and polysiloxane on an adhesive surface of the foil.
SOLUTION: A mixture coating layer of silane coupling agent and polysiloxane is provided on an adhesive surface of a copper foil. The adhesive surface of the foil is coated with a mixture aqueous solution containing 0.3 to 10g/l of concentration of the agent and 0.02 to 1.0g/l of concentration of the polysiloxane, heated to be dried, and manufactured. As the agent contained in the solution, vinyltrimethoxysilane, or vinyltriethoxysilane is used. In the agent, epoxysilane having an epoxy group in a molecule is preferable. The polysiloxane is a component for improving moisture resistance in the presence of the agent.
Inventors:
Katsumi Kobayashi
Kazuyoshi Aso
Kazuyoshi Aso
Application Number:
JP2936497A
Publication Date:
July 17, 2000
Filing Date:
February 13, 1997
Export Citation:
Assignee:
Nippon Electrolysis Co., Ltd.
International Classes:
B32B15/04; B32B15/08; B32B17/04; H05K3/38; (IPC1-7): B32B15/04; B32B15/08; H05K3/38
Domestic Patent References:
| JP8295736A |
Attorney, Agent or Firm:
Tetsuo Hodaka