Title:
COPPER FOIL FOR PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP3806677
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a copper foil for a printed circuit board in which an adhesive strength between the foil and a resin board is maintained highly even under severe conditions due to heat, chemical agent or the like at the time of laminating when a copper-clad laminate is formed and which has excellent migration resistance, which remarkably contributes to improvement in insulating characteristics of a printed circuit and which can be suitably used as copper foils for inner and outer layers of the board.
SOLUTION: The copper foil for the printed circuit board comprises a carbon- containing copper-zinc film layer on at least one surface of the foil. In the copper foil, the migration resistance is 390 to 450.
Inventors:
Kazuyoshi Aso
Masami Noguchi
Kobayashi Katsumi
Takeshi Yamagishi
Masami Noguchi
Kobayashi Katsumi
Takeshi Yamagishi
Application Number:
JP2002215070A
Publication Date:
August 09, 2006
Filing Date:
February 24, 1994
Export Citation:
Assignee:
Nippon Electrolysis Co., Ltd.
International Classes:
H05K1/09; C23C28/00; C25D3/56; C25D5/48; C25D7/06; H05K3/38; (IPC1-7): H05K1/09; C23C28/00; C25D3/56; C25D5/48; C25D7/06; H05K3/38
Domestic Patent References:
| JP6013749A | ||||
| JP63080412A | ||||
| JP51035711B1 | ||||
| JP4350937A |
Attorney, Agent or Firm:
Tetsuo Hotaka