Title:
COPPER FOIL FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, PROCESS OF MANUFACTURING THE SAME, AND RESIN SUBSTRATE FOR PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2014241447
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a copper foil for a printed wiring board capable of enhancing adhesive strength of the copper foil and a resin.SOLUTION: The copper foil for a printed wiring board has a roughening processing layer. After laminating a resin layer on the roughening processing layer, a total sum of projected areas of holes of the resin roughened surface having unevenness to which unevenness of the roughening processing layer is reflected is equal to or larger than 20% at a surface of the resin where the copper foil is removed by etching.
Inventors:
KOHIKI MICHIYA
MORIYAMA AKIMASA
MORIYAMA AKIMASA
Application Number:
JP2014188321A
Publication Date:
December 25, 2014
Filing Date:
September 16, 2014
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
H05K3/38; C23C28/00; C23C28/02; C25D1/04; C25D7/06; H05K3/18; H05K3/46
Domestic Patent References:
| JPH06169169A | 1994-06-14 | |||
| JP2005248323A | 2005-09-15 | |||
| JP2010118662A | 2010-05-27 | |||
| JP2008144232A | 2008-06-26 | |||
| JP2007046095A | 2007-02-22 |
Foreign References:
| WO2009145207A1 | 2009-12-03 | |||
| WO2010061736A1 | 2010-06-03 | |||
| WO2007145164A1 | 2007-12-21 |
Attorney, Agent or Firm:
Axis international patent business corporation