Title:
COPPER FOIL WITH CARRIER FOIL AND COPPER CLAD LAMINATED SHEET
Document Type and Number:
Japanese Patent JP2019178431
Kind Code:
A
Abstract:
To provide a copper foil with a carrier foil in that the carrier foil can be easily peeled off from a copper foil layer even when it is used for manufacturing a copper clad laminated sheet applied with a temperature of 250°C or more.SOLUTION: The copper foil with a carrier foil having a layer structure including a carrier foil, a junction interface layer, and a copper foil layer is characterized in that after performing heat treatment at 250°C for 60 minutes as the carrier foil, an electrolytic copper foil with the tensile strength of 40 kgf/mmor more is used, and after performing the heat treatment, a maximum diameter of a connection part between the carrier foil and the copper foil layer existing in the junction interface layer is 200 nm or less.SELECTED DRAWING: Figure 1
Inventors:
MATSUNAGA AKIHIRO
MATSUDA MITSUYOSHI
TAKANASHI TETSUAKI
KAWAI NOBUYUKI
MATSUDA MITSUYOSHI
TAKANASHI TETSUAKI
KAWAI NOBUYUKI
Application Number:
JP2019123171A
Publication Date:
October 17, 2019
Filing Date:
July 01, 2019
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO
International Classes:
C25D1/22; B32B7/022; B32B15/04; B32B15/20; C25D1/04; H05K1/09
Domestic Patent References:
| JP2008255462A | 2008-10-23 | |||
| JP2009221592A | 2009-10-01 | |||
| JP2010222657A | 2010-10-07 | |||
| JP2001062955A | 2001-03-13 | |||
| JP2005307270A | 2005-11-04 | |||
| JP2007217791A | 2007-08-30 | |||
| JP2005288856A | 2005-10-20 | |||
| JP2007294923A | 2007-11-08 |
Foreign References:
| WO2012002526A1 | 2012-01-05 |
Attorney, Agent or Firm:
Katsuhiro Yoshimura