Title:
Copper foil with carrier, its manufacturing method, copper-clad laminate manufacturing method and printed wiring board manufacturing method
Document Type and Number:
Japanese Patent JP6310193
Kind Code:
B2
Inventors:
Misato Honda
Application Number:
JP2013139285A
Publication Date:
April 11, 2018
Filing Date:
July 02, 2013
Export Citation:
Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
C25D1/22; B32B15/01; B32B15/08; C25D1/04; C25D7/06; H05K1/03; H05K1/09
Domestic Patent References:
| JP2007186782A | ||||
| JP2012102407A | ||||
| JP2013112891A | ||||
| JP2008111169A | ||||
| JP2013077702A | ||||
| JP2009018588A | ||||
| JP2010118662A |
Foreign References:
| WO2013065727A1 | ||||
| WO2010027052A1 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation