Title:
COPPER FOIL WITH CARRIER AND LAMINATED BOARD, PRINTED WIRING BOARD AND ELECTRONIC DEVICE USING SAME, AS WELL AS METHOD FOR PRODUCING PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2015061757
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a copper foil with a carrier which adheres suitably to a resin and is excellent in transparency of a resin after removing the copper foil by etching and to provide a laminated board using the same.SOLUTION: There is provided a copper foil with a carrier in which roughened particles are formed on an ultrathin copper layer surface by a roughening treatment, wherein the average roughness Rz of TD of the roughening-treated surface of the ultrathin copper layer is 0.20 to 0.80 μm, the 60-degree glossiness of MD of the roughening-treated surface is 76 to 350% and the ratio A/B between the surface area A of the roughened particles and the surface area B obtained when the roughened particles are planarly viewed from the surface side of the copper foil is 1.90 to 2.40.
Inventors:
NAGAURA YUTA
ARAI EITA
MIKI ATSUSHI
ARAI YASUNORI
NAKAMURO KAICHIRO
ARAI EITA
MIKI ATSUSHI
ARAI YASUNORI
NAKAMURO KAICHIRO
Application Number:
JP2014167989A
Publication Date:
April 02, 2015
Filing Date:
August 20, 2014
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
B32B15/01; B32B15/08; C25D1/04; C25D7/06; H05K1/09; H05K1/14; H05K3/20; H05K3/38
Attorney, Agent or Firm:
Axis International Patent Business Corporation