COPPER FOIL WITH CARRIER, PRINTED WIRING BOARD, LAMINATE, ELECTRONIC APPARATUS AND MANUFACTURING METHOD OF PRINTED WIRING BOARD

Title:

COPPER FOIL WITH CARRIER, PRINTED WIRING BOARD, LAMINATE, ELECTRONIC APPARATUS AND MANUFACTURING METHOD OF PRINTED WIRING BOARD

Document Type and Number:

Japanese Patent JP2015214750

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide a copper foil with a carrier having good suppressed change of peel strength of the carrier before and after heating press of the copper foil with the carrier.SOLUTION: The copper foil with a carrier has the carrier, an intermediate layer and an ultra thin copper layer in this order. A tensile strength reduction rate of the carrier after heating press of the copper foil with the carrier under a condition of pressure: 20 kgf/cmat 220°C for 2 hours is 20% or less.

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Inventors:

NAGAURA YUTA
KOHIKI MICHIYA

Application Number:

JP2015065006A

Publication Date:

December 03, 2015

Filing Date:

March 26, 2015

Export Citation:

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Assignee:

JX NIPPON MINING & METALS CORP

International Classes:

C25D1/04; B32B15/04; B32B15/20; C25D5/16; C25D7/06; H05K1/09; H05K3/38; H05K3/46

Domestic Patent References:

JP5352748B1	2013-11-27
JP2000309898A	2000-11-07
JP5298252B1	2013-09-25

Foreign References:

WO2014042201A1

2014-03-20

Attorney, Agent or Firm:

Axis International Patent Business Corporation

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