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Title:
COPPER FOIL WITH CARRIER, PRODUCTION METHOD OF COPPER FOIL WITH CARRIER, PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, COPPER-CLAD LAMINATE SHEET AND PRODUCTION METHOD OF PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2015009556
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a copper foil with a carrier in which before a lamination step to an insulation substrate, an adhesion force between a carrier and an extra thin copper layer is high, and after the lamination step to the insulation substrate, the carrier and the extra thin copper layer can be peeled and generation of a pinhole on an extra thin copper layer side surface is suppressed.SOLUTION: There is provided a copper foil with a carrier which comprises a carrier, an intermediate layer laminated on the carrie and an extra thin copper layer, where the intermediate layer is constituted of a W-Ni alloy, a W-Co alloy or a W-Fe alloy, the adhesion amount of Ni of the intermediate layer is 50 to 10000 μg/dm, the adhesion amount of Ni is 50 to 40000 μg/dmwhen each of the alloys is contained, the adhesion amount of Co is 50 to 10000 μg/dmand the adhesion amount of Fe is in a specific range, and when peeling is performed between the intermediate layer and the extra thin copper layer, each of the atomic concentration of W, Ni, Cu, Fe, Co, O, C and the other atoms in the depth direction (x: unit nm) obtained by the depth direction analysis from a surface by XPS is set in a specific range.

Inventors:
HONDA MISATO
Application Number:
JP2013139280A
Publication Date:
January 19, 2015
Filing Date:
July 02, 2013
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
B32B15/20; B32B15/08; C25D1/04; C25D5/10; C25D7/06; H05K1/09; H05K3/00
Attorney, Agent or Firm:
Axis international patent business corporation