To provide a copper foil with carrier in which an adhesive force between a carrier and an extremely thin copper layer is high before a process of lamination to an insulation substrate, meanwhile, adhesion between the carrier and the extremely thin copper layer decreases after the process of lamination to the insulation substrate, the carrier and the extremely thin copper layer can be easily stripped from each other on the interfacial surface between both and the surface of the extremely thin copper layer after stripping the carrier has satisfactory corrosion resistance.

A copper foil with carrier is made by laminating a copper foil carrier, an intermediate layer and an extremely thin copper layer in this order, the intermediate layer is configured in such a way that a chromium layer or a chromate layer and a nickel layer or a nickel-phosphor alloy layer are laminated in this order on a copper foil carrier, wherein a deposit amount of nickel, nickel-phosphor alloy and chromium in the intermediate layer are in a specific range and, when the copper foil is stripped from the extremely thin copper foil layer, the ratio of atomic concentration of chromium and nickel with respect to atomic concentration of chromium, nickel, copper, phosphor, carbon and oxygen in a depth direction (x: nm) obtained from the depth direction analysis from the surface according to XPS is in the specific range in the specific relational equation.