Title:
COPPER ION-CONTAINING SELF-ASSEMBLED COMPLEX
Document Type and Number:
Japanese Patent JP2023156975
Kind Code:
A
Abstract:
To provide a copper ion-containing self-assembled complex capable of adjusting components of the complex to adjust the self-disassembly rate of the structure, thereby controlling the delivery rate of an active ingredient.SOLUTION: A copper ion-containing self-assembled complex contains copper ions and one or more ligands. The ligands and the copper ions are reversibly self-assembled or self-disassembled. If there are multiple types of ligands or multiple ligands, the shape of the self-assembled complex is formed differently depending on a mixing ratio of the ligands.SELECTED DRAWING: Figure 1
Inventors:
KANG HEEMIN
LEE SUNG-GUE
KANG NA-YEON
KIM YU-RI
HONG HYUN-SHIK
LEE SANG-HYEOK
KIM CHO-WON
KIM SEONG-YEOL
LEE SUNG-GUE
KANG NA-YEON
KIM YU-RI
HONG HYUN-SHIK
LEE SANG-HYEOK
KIM CHO-WON
KIM SEONG-YEOL
Application Number:
JP2022183804A
Publication Date:
October 25, 2023
Filing Date:
November 17, 2022
Export Citation:
Assignee:
KOREA UNIV RES & BUSINESS FOUNDATION
International Classes:
C07H19/20; A01N59/20; A61K9/00; A61K9/70; A61K31/7076; A61K33/34; A61K47/24; A61P31/04; A61P31/10; A61P31/12; A61P43/00; C07F1/08
Attorney, Agent or Firm:
Tadashige Ito
Koichi Hirota
Tadahiko Ito
Koichi Hirota
Tadahiko Ito
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