Title:
COPPER-METALLIZING COMPOSITION AND GLASS CERAMIC CIRCUIT BOARD USING THE SAME
Document Type and Number:
Japanese Patent JP3420426
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a copper-metallizing composition which enables the simultaneous firing of the wiring layer and the glass ceramic porcelain without inhibition of wettability with solder in the following process and can effectively prevent the deformation of the insulation substrate, for example, warpage; and obtain a glass ceramic circuit board suitable for a variety of circuit boards or multi-layer wiring boards for high frequency wave by forming a copper wiring layer of low resistance on the insulation substrate of glass ceramic with a low dielectric constant.
SOLUTION: This copper-metallizing composition can be simultaneously fired together with a glass ceramic porcelain at 800-1,100°C and contains 0.1-5.0 pts.wt. of at least one selected from oxides of alkali metals, alkaline earth metals and boron per 100 pts.wt. of copper as a metal oxide lowering the viscosity of the glass component in the glass ceramic porcelain in this composition and contains 0.1-5.0 pts.wt. of an inorganic substance retarding the sintering of copper.
Inventors:
Toshiaki Shigeoka
Satoshi Hamano
Satoshi Hamano
Application Number:
JP10713696A
Publication Date:
June 23, 2003
Filing Date:
April 26, 1996
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H05K1/09; C03C8/18; C04B41/88; H01B1/02; H05K3/12; (IPC1-7): C04B41/88; H01B1/02; H05K1/09; H05K3/12
Domestic Patent References:
| JP5116985A |
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