銅ナノインク、プリント配線板用基板及び銅ナノインクの製造方法

Title:

銅ナノインク、プリント配線板用基板及び銅ナノインクの製造方法

Document Type and Number:

Japanese Patent JP7302350

Kind Code:

B2

Abstract:

To provide a copper nano ink capable of forming a sintered body layer of copper nanoparticles, which has a high reduction effect for copper oxide and excellent adhesion force to a base film.SOLUTION: A copper nano ink according to the present disclosure comprises: copper nanoparticles having an average particle diameter of 200 nm or less; a solvent in which the copper nanoparticles are dispersed; polyethylenimine; a polyvinyl alcohol; and a carboxylic acid.SELECTED DRAWING: None

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Inventors:

Hiroki Kakudo
Kazumasa Okada
Kei Hirai
Kazuya Tokuda

Application Number:

JP2019135473A

Publication Date:

July 04, 2023

Filing Date:

July 23, 2019

Export Citation:

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Assignee:

Sumitomo Electric Industries, Ltd.

International Classes:

B22F1/0545; B22F1/00; B22F9/00; B32B15/08; H05K1/09

Domestic Patent References:

JP2012172135A
JP2015180769A
JP2016152405A

Foreign References:

WO2007013393A1

Attorney, Agent or Firm:

Yoshinori Ikeda
Kazunori Amano
Koji Ishida

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