Title:
銅‐ニッケル‐ケイ素二相急冷基体
Document Type and Number:
Japanese Patent JP5128756
Kind Code:
B2
Abstract:
A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a network of nickel silicide phases. The microstructure is substantially homogeneous. Casting of strip is accomplished with minimal surface degradation as a function of casting time. The quantity of material cast during each run is improved without the toxicity encountered with copper-beryllium substrates.
Inventors:
Myojin, Shinya
Bye, Richard Elle
Gary Bee Schuster
Walls, Dale Earl
Cox, joseph gee
Millure, David W
Lynn, Jen S
De Christophalo, Nicholas Jay
Bye, Richard Elle
Gary Bee Schuster
Walls, Dale Earl
Cox, joseph gee
Millure, David W
Lynn, Jen S
De Christophalo, Nicholas Jay
Application Number:
JP2004505399A
Publication Date:
January 23, 2013
Filing Date:
May 15, 2003
Export Citation:
Assignee:
Methograss Incorporated
International Classes:
C22C9/06; B21J1/04; B21J5/00; B22D11/06; B22D21/00; C22F1/00; C22F1/08
Domestic Patent References:
| JP2000501341A |
Foreign References:
| WO2001000354A1 |
Attorney, Agent or Firm:
Shinjiro Ono
Kazuo Shamoto
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Hiroaki Noya
Kazuo Shamoto
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Hiroaki Noya