Title:
COPPER PAD STRUCTURE
Document Type and Number:
Japanese Patent JP3477452
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a structure and method that forms mechanically and electrically firm interconnection between the copper wiring of an integrated circuit and a solder ball without diffusing tin or lead from the solder ball to final copper wiring.
SOLUTION: This structure (and method) for metallurgy structure is equipped with a passivation layer, a via that passes through the passivation layer to extend to a metal line in the metallurgy structure, a barrier layer that allows the via to be subjected to lining, a metal plug that is the metal plug in the via on the barrier layer while the metal plug and the metal wire contain the same material, and a solder bump that is formed on the metal plug.
Inventors:
Wayne Jay Howell
Ronald El Mendelson
William T. Motosif
Ronald El Mendelson
William T. Motosif
Application Number:
JP2001073057A
Publication Date:
December 10, 2003
Filing Date:
March 14, 2001
Export Citation:
Assignee:
INTERNATIONAL BUSINESS MASCHINES CORPORATION
International Classes:
H01L23/52; H01L21/3205; H01L21/60; H01L23/485; (IPC1-7): H01L21/60; H01L21/3205
Domestic Patent References:
| JP11145142A | ||||
| JP10340920A | ||||
| JP5114629A | ||||
| JP2000164617A | ||||
| JP2000100847A |
Attorney, Agent or Firm:
Hiroshi Sakaguchi (1 person outside)