Title:
銅粒子及びその製造方法
Document Type and Number:
Japanese Patent JP7050756
Kind Code:
B2
Abstract:
These copper particles each comprise: a core part containing copper; and a copper oxide layer formed on the surface of the core part and containing CuO and Cu2O. The condition of Y ≥ 36X - 18 is satisfied where X is the content ratio (mass %) of oxygen contained in a copper particle and Y is the crystallite size (nm) of Cu2O contained in the copper oxide layer. It is also preferable that the value of DC/D50, that is, the ratio of the crystallite size DC (µm) of metallic copper contained in the core part to a volume cumulative particle size D50 (µm) at a cumulative volume of 50 volume % as measured using a laser diffraction/scattering particle size distribution measurement method, is between 0.10 and 0.40 inclusive. In addition, it is also preferable that the oxygen content ratio is between 0.80 mass % and 1.80 mass % inclusive.
Inventors:
Toshikazu Matsuyama
Kosuke Oda
Yoshiaki Uezumi
Endo Yasutoshi
Kosuke Oda
Yoshiaki Uezumi
Endo Yasutoshi
Application Number:
JP2019509979A
Publication Date:
April 08, 2022
Filing Date:
March 28, 2018
Export Citation:
Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
B22F1/00; B22F1/14; B22F1/16; B22F9/12
Domestic Patent References:
| JP2003530679A | ||||
| JP2002169273A |
Foreign References:
| WO2016052373A1 |
Attorney, Agent or Firm:
Showa International Patent Office