Title:
接合用銅ペースト、接合体の製造方法及び半導体装置の製造方法
Document Type and Number:
Japanese Patent JP6819598
Kind Code:
B2
Abstract:
Provided is copper paste for joining including metal particles, and a dispersion medium. The metal particles include sub-micro copper particles having a volume-average particle size of 0.12 µm to 0.8 µm, and flake-shaped micro copper particles having a maximum particle size of 1 µm to 20 µm, and an aspect ratio of 4 or greater, and the amount of the micro copper particles contained, which are included in the metal particles and have a maximum particle size of 1 µm to 20 µm and an aspect ratio of less than 2, is 50% by mass or less on the basis of a total amount of the flake-shaped micro copper particles.
Inventors:
Dai Ishikawa
Yuki Kawana
Chie Sukama
Nakao Takeo
Yoshinori Ejiri
Kazuhiko Kurabuchi
Yuki Kawana
Chie Sukama
Nakao Takeo
Yoshinori Ejiri
Kazuhiko Kurabuchi
Application Number:
JP2017539199A
Publication Date:
January 27, 2021
Filing Date:
September 07, 2016
Export Citation:
Assignee:
Showa Denko Materials Co., Ltd.
International Classes:
B22F7/08; B22F1/00; B22F1/068; H01B1/00; H01B1/22; H01L21/52
Domestic Patent References:
| JP2013247060A | ||||
| JP2015082385A |
Foreign References:
| WO2011114747A1 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Shimizu
Hiroyuki Hirano