Title:
COPPER PILLAR WITH IMPROVED COMPLETENESS AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2019143243
Kind Code:
A
Abstract:
To provide a copper pillar with improved structural completeness and a manufacturing method thereof.SOLUTION: A copper pillar has completeness improved so as to easily resist severe reflow conditions after solder bump application without being easily broken. A method for manufacturing a copper pillar with improved completeness includes a process of two-step electric plating with various current densities.SELECTED DRAWING: Figure 2
Inventors:
RAVI POKHREL
GALLAGHER MICHAEL K
GALLAGHER MICHAEL K
Application Number:
JP2019026372A
Publication Date:
August 29, 2019
Filing Date:
February 18, 2019
Export Citation:
Assignee:
ROHM & HAAS ELECT MAT
International Classes:
C25D5/10; C25D3/22; C25D3/60; C25D5/02; C25D5/50; C25D7/12; H01L21/60
Domestic Patent References:
| JP2017036499A | 2017-02-16 | |||
| JP2017036501A | 2017-02-16 | |||
| JP2017145502A | 2017-08-24 | |||
| JP2017036502A | 2017-02-16 | |||
| JP2017036500A | 2017-02-16 | |||
| JP2017222925A | 2017-12-21 | |||
| JP2003253490A | 2003-09-10 |
Attorney, Agent or Firm:
Patent Business Corporation Sender International Patent Office