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Patent Searching and Data


Title:
COPPER PILLAR WITH IMPROVED COMPLETENESS AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2019143243
Kind Code:
A
Abstract:
To provide a copper pillar with improved structural completeness and a manufacturing method thereof.SOLUTION: A copper pillar has completeness improved so as to easily resist severe reflow conditions after solder bump application without being easily broken. A method for manufacturing a copper pillar with improved completeness includes a process of two-step electric plating with various current densities.SELECTED DRAWING: Figure 2

Inventors:
ラヴィ・ポカレル
マイケル・ケイ・ギャラガー
Application Number:
JP2019026372A
Publication Date:
August 29, 2019
Filing Date:
February 18, 2019
Export Citation:
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Assignee:
ローム アンド ハース エレクトロニック マテリアルズ エルエルシー
Rohm and Haas Electronic Materials LLC
International Classes:
C25D5/10; C25D3/22; C25D3/60; C25D5/02; C25D5/50; C25D7/12; H01L21/60
Attorney, Agent or Firm:
特許業務法人センダ国際特許事務所