銅板材およびその製造方法、ならびに銅板材付き絶縁基板

Title:

銅板材およびその製造方法、ならびに銅板材付き絶縁基板

Document Type and Number:

Japanese Patent JP7203930

Kind Code:

B2

Abstract:

A copper sheet material according to an embodiment has a composition comprising 99.96% by mass or more of Cu and unavoidable impurities, and has such a property that the area percentage of crystal grains each having a GAM value, which is obtained from a crystal orientation analysis data in accordance with SEM-EBSD method, of less than 0.5° is 5% or less and the area percentage of crystal grains each having a GAM value of 0.5° or more and less than 1.0° is 50% or more.

More Like This:

JPS6365034	FINE COPPER WIRE AND ITS PRODUCTION
JP6837541	Electrical and electronic components with high strength and high electrical conductivity, copper alloys for semiconductors, and their manufacturing methods
JP5816583	Manufacturing method of Cu thin plate and Cu thin plate

Inventors:

Shingo Kawada
Shoichi Danjo
Yu Higuchi
Tsukasa Takasawa

Application Number:

JP2021188414A

Publication Date:

January 13, 2023

Filing Date:

November 19, 2021

Export Citation:

Click for automatic bibliography generation Help

Assignee:

THE FURUKAW ELECTRIC CO.,LTD.

International Classes:

C22C9/00; C22F1/08

Foreign References:

WO2020162445A1

Attorney, Agent or Firm:

Kimura Kiyoshi
Takuya Saito

Previous Patent: tablet printing machine

Next Patent: METHOD FOR DEHYDRATING HYDROUS FOOD