To easily form a homogeneous and dense copper plating film on the surface of a hydrophobic PTFE (polytetrafluoroethylene) substrate for a high frequency circuit.
In a plating method, following processes are successively performed: a process (1) of subjecting a PTFE substrate to a plasma treatment in the presence of helium gas; a process (2) of forming a self-assembled monolayer (SAM) on the surface of the substrate by reacting the substrate with a silane coupling agent; a process (3) of subjecting the substrate having the formed SAM thereon to an activation treatment using a catalyst solution for electroless plating, which is an aqueous solution containing a palladium salt; a process (4) of reducing palladium ions fixed on the substrate into metal palladium; a process (5) of forming an electroless copper plating film on the substrate by treating the resulting substrate with an electroless copper plating solution; and a process (6) of further forming an electrolytic copper plating film on the electroless copper plating film by treating the resulting substrate with an electrolytic copper plating solution.
HONDA KOJI
JP2007150221A | 2007-06-14 |
US5945486A | 1999-08-31 |
JPN6014029364; CHEN J-R, WAKIDA T: 'Studies on the Surface Free Energy and Surface Structure of PTFE Film Treated with Low Temperature' Journal of Applied Polymer Science Vol.63 No.13, 19970328, Page.1733-1739
JPN6014029365; ZHANG M C 他3名: 'Electroless Plating of Copper and Nickel on Surface-Modified Poly(tetrafluoroethylene) Films.' Journal of The Electrochemical Society Vol.148 No.2, 200102, Page.C71-C80
JPN6014029359; 柴原正文 他3名: '大気圧プラズマ処理によるポリテトラフルオロエチレンの表面改質' 表面技術 Vol.58 No.7, 20070701, Page.420-424
JPN6014029360; PRISSANAROON W 他3名: 'Electropolymerization of DBSA-doped polypyrrole films on PTFE via an electroless copper interlayer' SURFACE AND INTERFACE ANALYSIS Vol.35 No.12, 200312, Page.974-983