Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
COPPER REMOVAL ELECTROLYTIC TREATMENT METHOD, COPPER REMOVAL ELECTROLYTIC TREATMENT DEVICE
Document Type and Number:
Japanese Patent JP2019178354
Kind Code:
A
Abstract:
To provide a method for efficiently suppressing abnormal growth of copper grains while maintaining high current efficiency, and preventing generation of problems such as short circuit or reduction of operation efficiency.SOLUTION: There is provided a copper removal electrolytic treatment method in an electric nickel manufacturing process for manufacturing electric nickel from a copper-containing nickel chloride solution, the electric nickel manufacturing process includes a cementation process having a first process for reducing bivalent copper ion in a copper-containing nickel chloride solution to monovalent copper ion, and a second process for adding nickel mat and chlorine leach residue to the resulting slurry and stabilizing the monovalent copper ion as a sulfide, in the copper removal electrolytic treatment, a copper removal electrolytic treatment device in which a plurality of electrolytic tanks are arranged is used, a part of a reaction termination liquid obtained in the first process of the cementation process is supplied to each electrolytic tank to conduct a copper removal electrolytic treatment, and a part of the copper nickel chloride solution obtained by a chloride leach treatment is added to each electrolytic tank depending of deposition growth of a copper particle at an anode of each electrolytic tank.SELECTED DRAWING: Figure 4

Inventors:
大石 貴雄
佐藤 英明
田中 雄大
伊達 秀一
若松 貴文
Application Number:
JP2018067229A
Publication Date:
October 17, 2019
Filing Date:
March 30, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
住友金属鉱山株式会社
International Classes:
C25C1/08; C22B3/44; C22B23/00; C25C1/12; C25C7/06
Attorney, Agent or Firm:
正林 真之
林 一好