Title:
COPPER FOR WIRE
Document Type and Number:
Japanese Patent JP2017064794
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide copper for wire having few coarse particles of copper oxide near a surface thereof and capable of reducing generation of defects such as omission and cracks on the surface of copper wire.SOLUTION: Copper for wire is manufactured by continuously rolling a copper ingot, and when observing cross sections of optional three places, particles of copper oxide which exist in a region of 100 μm or less from a surface and have the maximum diameter of 10 μm or more are 15 pieces or less on an average.SELECTED DRAWING: Figure 1
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Inventors:
KOBAYASHI NORIYUKI
NANJO KAZUHIRO
UTSUNOMIYA KIYOTAKA
NAKAMOTO MINORU
NANJO KAZUHIRO
UTSUNOMIYA KIYOTAKA
NAKAMOTO MINORU
Application Number:
JP2016254695A
Publication Date:
April 06, 2017
Filing Date:
December 28, 2016
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
B21B1/16; B21B1/02; H01B1/02
Domestic Patent References:
| JP2007050440A | 2007-03-01 |
Attorney, Agent or Firm:
Hiroshi Yamano