To clarify a conductive circuit structure required to develop a printed circuit board allowing lead-free solder, and to provide a method for manufacturing the above circuit board.

This laminated copper wiring board is manufactured by laminating circuit boards with necessary electronic circuits on a copper plated insulator board, providing a hole penetrating the stacked circuit boards, and forming the conductive layer at the above hole through copper plating. In this laminated copper wiring board, the above copper plated layer is formed at the first copper plated layer on the board side and the second copper plated layer on the surface and the crystal grain diameter of the above second copper plated layer is larger than that of the first copper plated layer.