PURPOSE: To improve the heat resistance and adhesive property of the film by formed the film from an adhesion-reinforcing layer selected from the group consisting of copper thin-layer, copper oxide, copper and copper nickel alloy and from a heat-resisting synthetic-resin film layer.

CONSTITUTION: The thickness of a copper thin-layer is normally 1-15μm which is a preferred thickness for a copper layer mainly for printed circuit, but not limited to that value. The formation of the copper thin-layer is sufficient when a copper thin-layer formed by the method shows desirable properties such as layer for printed circuit and is separated without hindrance. As material for forming an adhesion-reinforcing layer, it is possible to cite copper oxide, copper or copper nickel alloy. An alloy containing a small quantity of Ni<0-1.0wt.% and Cu>100-99wt.% or thereabout is preferred as the copper nickel alloy. In this manner, when a small quantity of Ni is contained, it is possible to improve the adhesive property of the title film over the case of using Cu alone. At the time of etching the copper layer and forming a picture image, a residue remains in the case of using metals other than Ni.