To provide a general purpose core material for a printed circuit board that is suitable for reducing the designing/manufacturing time and the manufacturing cost of the printed circuit board.

The core material is composed of at least one dielectric core layer including first and second surfaces, and a plurality of conducting cylinders connected to the first and second surfaces of the dielectric core layer through the dielectric core layer. The cylinders are arranged either in an array or apart from each other at a constant distance in the dielectric core layer. In addition, each of the first and second surfaces of the dielectric core layer is provided with a conducting layer, respectively, if necessary.