Title:
CORRECTION FACTOR CALCULATION METHOD
Document Type and Number:
Japanese Patent JP2022187701
Kind Code:
A
Abstract:
To grind a sectional shape of a wafer into a prescribed sectional shape within less time.SOLUTION: A correction factor calculation method comprises: a first trial grinding step of grinding a wafer 41; a first sectional shape recognition step of measuring thicknesses of the ground wafer 41 at three places and recognizing a first sectional shape of the wafer 41; an inclination changing step of changing inclination at a first value 81 so that a sectional shape of a next wafer 41 can be a finish sectional shape; a second trial grinding step of grinding the wafer 41 held on a holding surface 200 changed in the inclination changing step; a second sectional recognition step of measuring the thicknesses of the wafer 41 ground in the second trial grinding step at the three places and recognizing a second sectional shape of the wafer 41; and an inclination change correction factor calculation step of calculating an inclination change correction factor from an inclination change correction factor=the first value/(the first value-the second value) so that a sectional shape of a next ground wafer can be the finish sectional shape.SELECTED DRAWING: Figure 1
Inventors:
MURAMATSU SATOSHI
Application Number:
JP2021095836A
Publication Date:
December 20, 2022
Filing Date:
June 08, 2021
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B49/02; B24B7/04; H01L21/304
Attorney, Agent or Firm:
Patent Attorney Corporation Tokyo Alpa Patent Office