Title:
耐食性部材とその製造方法および半導体・液晶製造装置用部材
Document Type and Number:
Japanese Patent JP4780932
Kind Code:
B2
Inventors:
Yoshihiro Okawa
Toshiyuki Hamada
Toshiyuki Hamada
Application Number:
JP2004155200A
Publication Date:
September 28, 2011
Filing Date:
May 25, 2004
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
C04B35/50; H01L21/205; H01L21/3065
Domestic Patent References:
| JP2001181042A | ||||
| JP2003055050A | ||||
| JP2002255647A | ||||
| JP2002068838A | ||||
| JP2002001865A | ||||
| JP2001335367A | ||||
| JP2001322871A | ||||
| JP2003086475A |