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Patent Searching and Data


Title:
CORROSIVE SOLUTION
Document Type and Number:
Japanese Patent JPH05295567
Kind Code:
A
Abstract:

PURPOSE: To raise the corrosion or erosion rate of copper and copper based alloy.

CONSTITUTION: A corrosive soln. contains tetramin copper sulfate, ammonia, ammonium sulfate, ammonium chloride and ammonium nitrate, if needed, for corroding a copper and copper based circuit board and a formation part, and a catalyst for increasing the corrosion rate and is recoverable by electrolysis. This corrosive soln. contains vanadium or a vanadium compd. in the quantity of 1 mg to 99 mg per liter of a corrosive liq. as a catalyst when calculated as vanadium.


Inventors:
BERUNTO RINDENGAA
Application Number:
JP9556092A
Publication Date:
November 09, 1993
Filing Date:
April 15, 1992
Export Citation:
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Assignee:
ERO HIEMU ETSUTSUTEHINIKU GMBH
International Classes:
C23F1/34; C23F1/46; H05K3/06; (IPC1-7): C23F1/34; C23F1/46; H05K3/06
Attorney, Agent or Firm:
Kazuo Sato (2 outside)