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Title:
CORRUGATED BOARD-LIKE THREE-DIMENSIONAL WOVEN FABRIC HAVING SOFT TEXTURE AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
Japanese Patent JP2004183128
Kind Code:
A
Abstract:

To obtain a corrugated board-like three-dimensional woven fabric having soft feeling without impairing cushionability and to provide a method for producing the same.

The corrugated board-like three-dimensional woven fabric having soft texture comprises a surface layer having woven fabric construction, a back layer having woven fabric construction and a connection layer which is bent in a wave-like state and has woven fabric construction. At least a polyester multifilament having ≤1.5 dtex single filament fineness and ≥30 filaments or its composite yarn is arranged in warps and wefts forming the surface layer and warps and wefts forming the back layer.


Inventors:
IWASHITA KENJI
Application Number:
JP2002349630A
Publication Date:
July 02, 2004
Filing Date:
December 02, 2002
Export Citation:
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Assignee:
TEIJIN FIBERS LTD
International Classes:
D06C7/02; D03D11/00; D03D15/00; D03D17/00; D03D25/00; (IPC1-7): D03D11/00; D03D15/00; D03D25/00; D06C7/02
Attorney, Agent or Firm:
Hideko Mihara