To provide a small-sized, high-performance electronic component, especially a coupler, having a dielectric constant higher than those of conventional materials, which does not deteriorate in strength and is superior in overall electric characteristics, to provide an electronic component, especially a coupler, in which the variations of the electrical characteristics between the production lots, especially the dielectric constant of a using material is restrained, and further wearing of a metal mold at formation of the material is restrained, and to provide an electronic component, especially a coupler of high breakdown voltage.
This coupler is provided with a structure, in which constituent layers containing resin are laminated to form a multi-layer. At least one layer of the constituent layers is a composite dielectric material layer, in which circular, flat-circular or elliptical dielectric materials are dispersed inside the resin.
ENDO TOSHIICHI
