Title:
カバーフィルム
Document Type and Number:
Japanese Patent JP5752143
Kind Code:
B2
Abstract:
Disclosed is a cover film which is used in combination with a carrier tape and comprises at least a base layer (A), an intermediate layer (B), a releasing layer (C) and a heat seal layer (D) that is capable of being heat sealed to the carrier tape. The intermediate layer (B) contains, as a main component, a linear low density polyethylene that is polymerized using a metallocene catalyst and has a tensile modulus of 200 MPa or less. The releasing layer (C) contains a conductive material and also contains, as a main component, a hydrogenated resin of an aromatic vinyl-conjugated diene copolymer having an aromatic vinyl group content of 15-35% by mass. This cover film is small in variation in peel strength when the cover film is released, and is thus capable of suppressing troubles during the releasing in a mounting process.
Inventors:
Akira Sasaki
Tokunaga Kuji
Fujimura Tetsuo
Tokunaga Kuji
Fujimura Tetsuo
Application Number:
JP2012538584A
Publication Date:
July 22, 2015
Filing Date:
April 18, 2011
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
International Classes:
B65D73/02; B32B27/00; B32B27/18; B65D65/40; B65D85/86
Domestic Patent References:
| JPH09267450A | 1997-10-14 | |||
| JP2000280411A | 2000-10-10 | |||
| JP2007331783A | 2007-12-27 | |||
| JP2003246358A | 2003-09-02 | |||
| JP2001287294A | 2001-10-16 | |||
| JP2001293814A | 2001-10-23 | |||
| JP2004175889A | 2004-06-24 | |||
| JP3988495B2 | 2007-10-10 | |||
| JP2004237996A | 2004-08-26 | |||
| JP2000327024A | 2000-11-28 | |||
| JPH09267450A | 1997-10-14 | |||
| JP2000280411A | 2000-10-10 | |||
| JP2007331783A | 2007-12-27 |
Foreign References:
| WO2010055804A1 | 2010-05-20 | |||
| WO2010104010A1 | 2010-09-16 |
Attorney, Agent or Firm:
Kobayashi Yoshinori
Sonoda Yoshitaka
Sonoda Yoshitaka