To provide a cover-lay film in a flexible printed circuit board (FPC) and the like, which has sufficient adhesive strength and is suppressed as much as possible in oozing out of an adhesive material at an opening portion such as a terminal part or a land part of a circuit pattern.

The cover-lay film 210 comprises a film substrate 200 and, laminated thereon, at least two adhesive layers having a different gelling time, and flow properties of the adhesive layers are graded so as to increase from the film substrate side to the outside according to the difference in the gelling time. The cover-lay film 210 is pasted on the base film 100 and the circuit pattern 120 to give an FPC 300 having sufficient adhesive strength and suppressed as much as possible in oozing out of an adhesive material at an opening part such as a circuit pattern and the like.