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Patent Searching and Data


Title:
COVER TAPE FOR CARRIER OF ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JPH0640468
Kind Code:
A
Abstract:

PURPOSE: To maintain the adhesive state stably by the stress absorbing action at the foamed part by foam-processing a pressure-sensitive adhesive layer being provided on a cover tape at a location which corresponds to a component storage recessed part being provided on a carrier tape main body.

CONSTITUTION: A cover tape for which a pressure-sensitive adhesive layer 5 is provided on one surface of a supporting base 3 is put on the top of a carrier tape main body and bonded carrier tape main body on which electronic component storage recessed parts are provided in the longitudinal direction with even intervals, in order to close the recessed part after the electronic component is contained. For such a carrier tape, as a pressure-sensitive adhesive layer 4, a composition which is expandable by heating is sued. Then, only the pressure-sensitive adhesive layer 4 at an intermediate part in the width, which faces the component storage recessed part of the carrier tape main body, of the pressure-sensitive adhesive layer 4 of the cover tape is expanded. At this time, the difference in the thickness between the expanded part and non- expanded part is kept to be 100μm or less. By this method, a stable adhered state of the cover tape is ensured, and at the same time, the electronic component is prevented from transferring to the cover tape side.


Inventors:
Hanai, Takaomi
Okuno, Toshimitsu
Oshima, Toshiyuki
Application Number:
JP1992000213787
Publication Date:
February 15, 1994
Filing Date:
July 17, 1992
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
B65D73/02; (IPC1-7): B65D73/02
Attorney, Agent or Firm:
松月 美勝