COVER TAPE AND ELECTRONIC COMPONENT PACKAGE

Title:

COVER TAPE AND ELECTRONIC COMPONENT PACKAGE

Document Type and Number:

Japanese Patent JP2007331783

Kind Code:

A

Abstract:

To provide a cover tape that reduces variation in sealing strength relative to carrier tape and excels in antistatic performance, and to provide an electronic component package that is unlikely to cause jumping trouble, a chip rise phenomenon or such trouble.

This cover tape 10 includes a substrate 11, an antistatic layer 12 containing an antistatic agent, an antistatic adhesive layer 13 disposed between the substrate 11 and antistatic layer 12 and containing an antistatic adhesive, and a sealant layer 14 formed on the antistatic layer 12 and opposite to the antistatic adhesive layer 13.

Inventors:

HIRAIWA SHIGENOBU

Application Number:

JP2006164571A

Publication Date:

December 27, 2007

Filing Date:

June 14, 2006

Export Citation:

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