Title:
カバーテープおよび電子部品包装体
Document Type and Number:
Japanese Patent JP7003099
Kind Code:
B2
Abstract:
To provide a cover tape which prevents sticking of an electronic component and has good heat-sealability with a carrier tape.SOLUTION: A cover tape includes a base material layer including polyethylene terephthalate, a sealant layer containing a styrene-based resin, and an intermediate layer provided between the base material layer and the sealant layer. When a diiodomethane contact angle is represented by θd and a hexadecane contact angle is represented by θh in an exposed surface on a sealant layer side of the cover tape, a value of θh/θd is 0.25 to 0.55.SELECTED DRAWING: Figure 1
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Inventors:
Abe Koki
Application Number:
JP2019222664A
Publication Date:
January 20, 2022
Filing Date:
December 10, 2019
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
B65D85/86; B32B3/30; B32B25/08; B32B27/30; B32B27/32; B32B27/36; B65D73/02
Domestic Patent References:
| JP2017222387A | ||||
| JP2015199329A | ||||
| JP201994127A |
Foreign References:
| WO2007123241A1 | ||||
| WO2016076331A1 | ||||
| WO2018168475A1 |
Attorney, Agent or Firm:
Shinji Hayami