Title:
COVER TAPE FOR PACKAGING ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2016068987
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a cover tape for packaging an electronic component capable of suppressing generation of static electrification due to friction on a surface opposite to a surface of a sealant layer.SOLUTION: A cover tape 10 for packaging an electronic component includes: a base material layer 1; a sealant layer 2 disposed on one face side of the base material layer 1; and a conductivity polymer layer 3 disposed on the other face side of the base material layer 1. Friction static electrification voltage on a surface of the conductivity polymer layer 3 is -2200 to 2200 V.SELECTED DRAWING: Figure 2
Inventors:
MORIFUJI RYOSUKE
Application Number:
JP2014198471A
Publication Date:
May 09, 2016
Filing Date:
September 29, 2014
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
B65D85/86; B65D73/02
Domestic Patent References:
| JP2002193377A | 2002-07-10 | |||
| JP2004058648A | 2004-02-26 | |||
| JP2003128132A | 2003-05-08 | |||
| JP2005272638A | 2005-10-06 | |||
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| JP2010077294A | 2010-04-08 |