Title:
COVER TAPE FOR PACKAGING ELECTRONIC COMPONENT, ELECTRONIC COMPONENT PACKAGING BODY, AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
Japanese Patent JP2022044697
Kind Code:
A
Abstract:
To provide a cover tape for packaging an electronic component capable of stably exhibiting peeling strength when peeling it from a carrier tape and inhibiting static electricity due to a low a surface resistance value from being caused by peeling.SOLUTION: The cover tape 10 for packaging an electronic component includes a sealant layer 2, an intermediate layer 4 and a base material layer 6 in this order and used for sealing the electronic component by the sealant layer 2; the intermediate layer contains polyethylene and has a thickness of 30 to 60 μm and a hardness (durometer D) of 35 to 52 in the thickness based on JIS 7215; the sealant layer has a thickness of 0.15 to 0.5 μm; and a ratio b/a of the thickness a (μm) of the sealant layer to the thickness b (μm) of the intermediate layer is 60 to 300.SELECTED DRAWING: Figure 1
Inventors:
SUZUKI MASASHI
YAKABE TORU
SASAKI KENTA
ABE HIROKI
UEMURA SHOJI
YAKABE TORU
SASAKI KENTA
ABE HIROKI
UEMURA SHOJI
Application Number:
JP2022008473A
Publication Date:
March 17, 2022
Filing Date:
January 24, 2022
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
B65D65/40; B65D85/86; B65D73/02
Attorney, Agent or Firm:
Shinji Hayami
Previous Patent: JPWO2022044696
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