Title:
COVER TAPE FOR PACKAGING ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2022081138
Kind Code:
A
Abstract:
To provide a cover tape for packaging an electronic component which has an excellent balance of adhesiveness and peelability to a carrier tape when antimony is reduced, and can suppress the generation of static electricity due to peeling.SOLUTION: A cover tape for packaging an electronic component according to the present invention includes a base material layer, an intermediate layer, and a sealant layer in this order, the sealant layer includes an adhesive resin and an antistatic agent, and the antistatic agent includes one or more selected from the group consisting of (A) phosphorus-doped tin, (B) carbon nanotubes, (C) polythiophene or a polythiophene derivative, the 170° peel strength for a polystyrene film having an average surface roughness of 0.25 μm is 0.3 N or more and 0.9 N or less, and the antimony content for the entire cover tape is 0 ppm or more and 150 ppm or less.SELECTED DRAWING: Figure 1
Inventors:
UEMURA SHOJI
YAMAGUCHI KEITA
YAMAGUCHI KEITA
Application Number:
JP2020192491A
Publication Date:
May 31, 2022
Filing Date:
November 19, 2020
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
H05F1/02; B32B27/18; B65D65/40; H05F1/00
Attorney, Agent or Firm:
Shinji Hayami
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