Title:
電子部品包装用カバーテープ
Document Type and Number:
Japanese Patent JP4899593
Kind Code:
B2
Inventors:
Masayuki Hiramatsu
Application Number:
JP2006103904A
Publication Date:
March 21, 2012
Filing Date:
April 05, 2006
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
B65D73/02; B32B7/02; B32B7/06; B32B7/12; B32B27/00; B65D85/86; C09J7/02; C09K3/16
Domestic Patent References:
| JP5032288A | ||||
| JP2000142786A | ||||
| JP7096585A | ||||
| JP2002347831A | ||||
| JP2002012288A |