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Title:
COVER TAPE FOR PACKAGING ELECTRONIC PART
Document Type and Number:
Japanese Patent JP3201505
Kind Code:
B2
Abstract:

PURPOSE: To reduce a dependency of a peel-off strength on a sealing temperature by a method wherein an outer layer is made a biaxially oriented film of a polyester or the like, an intermediate layer is made of polyethylene, a sealant is made of a mixture of polyethylene and polystyrene, and the surface of the sealant is subjected to a corona discharge treatment.
CONSTITUTION: In a cover tape for heat-sealing a plastic-made carrier tape with storage pockets continuously provided for containing electronic parts, an outer layer 2 is made of a biaxially oriented film of a polyester, polypropylene, or a nylon, and an intermediate layer 3 is made of polyethylene. A sealant 4 is a mixture containing 5-100 pts.wt. polystyrene having a melt flow rate 10-30g/10min per 100 pts.wt. of polyethylene having a melt flow rate of 10-30g/10min. The surface of the sealant is subjected to a corona discharge treatment to have a surface tension of 35-50dyne/cm. The visible light transmission of the cover tape 1 is adjusted to be not less than 75%. In this manner, ideal characteristics can be held.


Inventors:
Hisao Nakanishi
Application Number:
JP234295A
Publication Date:
August 20, 2001
Filing Date:
January 11, 1995
Export Citation:
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Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
B65D85/86; B32B27/00; B65D73/02; H01L21/673; H01L21/68; H05K13/02; (IPC1-7): B65D85/86; B32B27/00; B65D73/02
Domestic Patent References:
JP532275A
JP398865A
JP378768U
JP364256U



 
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