Title:
COVER TAPE FOR PACKING ELECTRONIC COMPONENT AND PACKAGE
Document Type and Number:
Japanese Patent JP2021178470
Kind Code:
A
Abstract:
To provide a cover tape for packing an electronic component with improved visibility of the electronic component.SOLUTION: A cover tape for packing an electronic component includes a base layer 2, a heat seal layer 3 disposed on one surface of the base layer 2, and an intermediate layer 4 disposed between the base layer 2 and the heat seal layer 3. An average length (Rsm) of roughness curved line elements on a surface of a side of the heat seal layer of the cover tape for packing the electronic component is 200 μm or less.SELECTED DRAWING: Figure 1
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Inventors:
YANAGISAWA SHUNPEI
NAGATSUKA YASUNORI
INOUE MASAKUNI
NAGATSUKA YASUNORI
INOUE MASAKUNI
Application Number:
JP2020085319A
Publication Date:
November 18, 2021
Filing Date:
May 14, 2020
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
B32B7/022; B32B27/00; B65D73/02; B65D85/86; C09J7/29; C09J7/35
Attorney, Agent or Firm:
Akihiko Yamashita
Kishimoto Tatsuto
Kishimoto Tatsuto