Method for manufacturing coated copper nanoparticles, copper nanoparticle dispersion, and conductive substrate

Title:

Method for manufacturing coated copper nanoparticles, copper nanoparticle dispersion, and conductive substrate

Document Type and Number:

Japanese Patent JP6331386

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a coated copper nanoparticle and a copper nanoparticle dispersion excellent in oxidation resistance, dispersibility, coating adaptability, and sintering property at a low temperature or in a short time, and a method for manufacturing a conductive substrate by using the above dispersion.SOLUTION: The coated copper nanoparticle comprises a copper nanoparticle coated with an alkyl amine and a polyallylamine derivative having a structural unit represented by the formula below. The copper nanoparticle dispersion comprises copper nanoparticles, an alkyl amine, a polyallylamine derivative having a structural unit of a specific structure, and a solvent. The method for manufacturing a conductive substrate includes steps of: applying a coating liquid containing a copper nanoparticle dispersion that comprises copper nanoparticles, an alkyl amine, a polyallylamine derivative having a structural unit of a specific structure, and a solvent, on a substrate to form a coating film; and firing the coating film. In the formula, Rrepresents an isolated amino group or a group represented by a specific formula, and a plurality of Rmay be the same or different from one another, however, at least one of the plurality of Ris a group represented by the specific formula.

Inventors:

Yousuke Taguchi
Yoshinobu Omori
Mikiko Hojo

Application Number:

JP2013270269A

Publication Date:

May 30, 2018

Filing Date:

December 26, 2013

Export Citation:

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