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Title:
COVERING WITH METAL THIN FILM
Document Type and Number:
Japanese Patent JP3169443
Kind Code:
B2
Abstract:

PURPOSE: To attempt improvement of an adhesive property by a method wherein when a metal thin film is formed on a substrate having many voids, after forming a thin film on a substrate surface with heat resistant resin, the metal thin film is formed.
CONSTITUTION: On forming a metal thin film-coated substrate wherein a metal thin film 3 has been formed on a substrate 1 having many voids, a thin film is formed on a surface of the substrate 1 having many voids with heat resistant resin, preferably heat resistant resin 2 of at least 60°C glass transition temperature. Thereafter, the metal thin film 3 is formed by, for example, vapor deposition. Preferably vapor deposition of the metal thin film is carried out by sputtering of a steel thin film. Further, as a method for forming a resin thin film, there are a method wherein a solution in which resin is dissolved in a solvent, and resin are heated, which are applied as melted and others.


Inventors:
Mitsuo Takase
Nobuhiro Fukuda
Satoshi Kawamoto
Application Number:
JP20654192A
Publication Date:
May 28, 2001
Filing Date:
August 03, 1992
Export Citation:
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Assignee:
Mitsui Chemicals, Inc.
International Classes:
B32B13/12; B32B15/08; C23C14/06; (IPC1-7): B32B13/12; B32B15/08; C23C14/06
Domestic Patent References:
JP115382B2
JP6151989B2



 
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