PURPOSE: To allow thin solder feed corresponding to fine parts and thick solder feed corresponding to large-sized parts to coexist in the same printed wiring boardlike state.

CONSTITUTION: Since the title method is constituted so that in a process after cream solder printing by a thin metal mask, cream solder 5 is printed by a thick metal mask 3 wherein contacting with cream solder 2 formed by the thin metal mask is avoided by a half etching part 3-1, since fine parts whose space between terminals is short are soldered by the thin cream solder 2 printed by the thin metal mask, an obstacle such as a solder bridge is eliminated. Furthermore, since large-sized parts 4 whose floating of the terminal is high are soldered by the thick cream solder 5 which is printed by the thick metal mask 3, generation of an unsoldering trouble is eliminated.