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Patent Searching and Data


Title:
CREAM SOLDER PRINTING PROCESS AND DEVICE
Document Type and Number:
Japanese Patent JP2004025644
Kind Code:
A
Abstract:

To provide a cream solder printing process which keeps the viscosity of a cream solder at a specified level despite the long waiting period of a cream solder printing device, and a device used for this process.

This cream solder printing process undergoes the following steps: A circuit substrate is carried to a table part for retaining the circuit substrate horizontally and carried out, then the table part is pressed to a spot under a screen with an opening part which matches a pattern of the electrode part of the circuit substrate so that the opening part coincides with the pattern, and the cream solder is printed on the electrode part of the circuit substrate after filling the opening part with the cream solder by moving a printing head over a screen. When the cream solder is not printed for a specified period, the printing head is automatically actuated in a dummy filling fashion under the same conditions as when the circuit substrate is filled with the cream solder. After that, the viscosity of the cream solder is kept at the same level by stirring the cream solder.


Inventors:
HATTORI YOSHIYUKI
NAKAHIRA HITOSHI
NISHIKAWA NOBORU
Application Number:
JP2002185851A
Publication Date:
January 29, 2004
Filing Date:
June 26, 2002
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B41F15/40; B41F15/08; H05K3/34; (IPC1-7): B41F15/40; B41F15/08; H05K3/34
Attorney, Agent or Firm:
Masaru Ishihara