Title:
大きなパッケージ平面を１つ以上の基板上に適合させるための切目ファイルの作成
Document Type and Number:
Japanese Patent JP6835478
Kind Code:
B2
Abstract:
A package design system creates one or more package design files by creating cut line instructions and fold line instructions for a package flat. If the system determines that the package flat should be split into two or more subparts across two or more substrates or two or more sub-regions of a single substrate, it will select a fold line and convert the selected fold line to a seam. Conversion to a seam may occur by creating cut line instructions for the selected fold line, imparting a first set of functional elements on a first side of the seam, and imparting a second set of functional elements on a second side of the seam. The first set of functional elements and the second set of functional elements will form a functional connection when the three-dimensional structure is formed.
Inventors:
Reiner Eschbach
Stefan Sea Morgana
Stefan Sea Morgana
Application Number:
JP2016090248A
Publication Date:
February 24, 2021
Filing Date:
April 28, 2016
Export Citation:
Assignee:
XEROX CORPORATION
International Classes:
B31B50/00; B31B50/14; B31B50/25
Domestic Patent References:
| JP2014031006A | ||||
| JP7241941A | ||||
| JP2012126420A |
Foreign References:
| WO2014119439A1 |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Kato Kazunori