PURPOSE: To improve the penetration into and adhesion to a substrate surface by compounding a specific binder resin, a crosslinkage monomer, and a photopolymn. initiator.
CONSTITUTION: The title compsn. is prepd. by compounding 45-75 pts.wt. binder resin, 25-55 pts.wt. crosslinkage monomer having at least two ethylenically unsatd. bonds, and 0-10 pts.wt. photopolymn. initiator. The binder resin comprises 10-90wt.% thermoplastic polymer (A) with a glass transition point of 66-88°C and wt.-average mol.wt. of 75000-200000 and 90-10wt.% thermoplastic polymer (B) with a glass transition point of 92-120°C and wt.-average mol.wt. of 75000-200000. The thermoplastic polymer A comprises: 15-35wt.% 3-15C monomer having an α,β-unsatd. carboxyl group [component (a)]; 10-55wt.% 1-8C alkyl acrylate and/or 2-8C hydroxyalkyl acrylate [component (b)]; 10-75wt.% 1-8C alkyl methacrylate and/or 2-8C hydroxyalkyl methacrylate [component (c)]; and 0-45wt.% styrenic compd. of formula I (wherein R1 is H, 1-6C alkyl, or halogen) and/or ring-substd. deriv. thereof [component (d)]. The thermoplastic polymer B comprises: 15-35wt.% component (a); 5-30wt.% component (b); 10-80wt.% component (c); and 0-45wt.% styrenic compd. of formula II (wherein R2 is R1) and/or ring-substd. product thereof [component (e)].
INUKAI KENICHI
IZEKI TAKAYUKI
FUJIMOTO YASUYUKI
KOYANAGI SEIYA
