Title:
CROSSLINKING-GROUP-CONTAINING COPOLYMER BUILDUP FILM AND RESIST MATERIAL CONTAINING THE SAME
Document Type and Number:
Japanese Patent JP3430796
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a copolymer capable of being built up by forming a copolymer comprising two specified types of structural units in a specified ratio and to obtain a buildup film made from this copolymer, and a light- or electron- beam-crosslinked resist material made of this film.
SOLUTION: Sixty (60) to 95mol% N-alkyl-substituted acrylamide and 4- vinylpyridine are polymerized in an aromatic hydrocarbon solvent to obtain a copolymer comprising structural units represented by formula I (wherein m is 10-14) (step a). The copolymer obtained in step a is dissolved in an alcohol, an excess of an ω-halogen-alkylalcohol is added to the solution to quaternize the pyridine part, the obtained copolymer solution is poured into a poor solvent to obtain a copolymer comprising structural units represented by formula II (wherein n is 1-12; and X is a halogen or ClO4) (step b). The copolymer obtained in step b is esterified to obtain a copolymer containing 60-95% structural units represented by formula I and 40-5wt.% structural units represented by formula II and having a number-average molecular weight of 3,000-100,000 (step c).
Inventors:
Tokuji Miyashita
Jun Aoki
Jun Aoki
Application Number:
JP14088196A
Publication Date:
July 28, 2003
Filing Date:
May 09, 1996
Export Citation:
Assignee:
Chisso Corporation
International Classes:
G03F7/038; B05D1/20; C08F20/52; C08F26/00; C08F220/56; C08F226/06; (IPC1-7): C08F220/56; B05D1/20; C08F226/06; G03F7/038
Domestic Patent References:
| JP62260140A |