Title:
CRYOPUMP AND HEAT INSULATION STRUCTURE FOR CRYOPUMP
Document Type and Number:
Japanese Patent JP2022092331
Kind Code:
A
Abstract:
To provide a cryopump and a heat insulation structure for the cryopump that can restrain occurrence of dew condensation on an outer surface of the cryopump, and enhance mechanical strength of the heat insulation structure.SOLUTION: A cryopump comprises: a pump case 11 comprising a first cylindrical part 11A, and a bottom part 11B for closing one end part in the first cylindrical part 11A; a first heat insulation member 21 having first heat conductivity and first rigidity, and located outside the pump case 11 in a radial direction of the first cylindrical part 11A; and a second heat insulation member 22 having second heat conductivity and second rigidity, located outside the pump case 11 in the radial direction of the first cylindrical part 11A, and including a portion located inside the first heat insulation member 21. The first heat conductivity is lower than the second heat conductivity. The first rigidity is higher than the second rigidity.SELECTED DRAWING: Figure 1
Inventors:
PIAO WENGUAN
HIDAKA KOSUKE
SUZUKI NAOTO
MURAYAMA YOSHINOBU
HIDAKA KOSUKE
SUZUKI NAOTO
MURAYAMA YOSHINOBU
Application Number:
JP2020205093A
Publication Date:
June 22, 2022
Filing Date:
December 10, 2020
Export Citation:
Assignee:
ULVAC KURAIO KK
International Classes:
F04B37/08
Domestic Patent References:
| JP2019143537A | 2019-08-29 | |||
| JP2011237072A | 2011-11-24 |
Foreign References:
| WO2016027460A1 | 2016-02-25 |
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Hironobu Onda
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